Design for reliability, Built-in reliability, Virtual qualification, Reliability simulation, Advanced models for Reliability prediction, Reliability test structures, Limits to accelerated tests, Screening methods, Yield/reliability relationship, Obsolescence, Counterfeiting.

Electron-, ion-, and optical beam techniques, Scanning probe techniques, Static or dynamic techniques, Backside techniques, Acoustic microscopy, Electric or magnetic field based techniques, Electrical-, thermal-, and thermo-mechanical characterization, Sample preparation, Construction analysis, Failure analysis: case studies.

Electrical modeling and simulations, Mechanical modeling and simulations, 3D/through-Silicon vias, Flip chip, Advanced substrates, Chip/package interaction.

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Solar cells and displays, optoelectronics, organic electronics: OLED, Electronic Ink, TFT.

ESD-EOS, latchup, EMC-EMI in integrated circuits and power electronic systems, Radiation impact on circuits and system reliability.

Process-related issues, Passivation stability, Hot carriers injection, NBTI, TDDB, High-K dielectrics and gate stacks, Low-K dielectrics and Cu interconnects, Metal migration: mechanical and thermal aspects, Non-volatile and programmable cells, Silicon-on-Insulator devices, Nano-electronics, Nano-electronic materials for solid state devices.

Wide-bandgap- and other Microwave semiconductor devices.

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Bio-electronics, Bio-sensors, Nano-bio-technologies, MEMS and MOEMS, NEMS and nano-objects.

EVs, HEVs, batteries, powertrains, supercaps, charging stations, V2G, thermal management, standardization.