Keynotes
Keynote I – Integrated Workflows for Physical Failure Analysis
Tomas Vystavel – Thermo Fisher Scientific
As semiconductor devices become more structurally complex, physical failure analysis increasingly depends on how effectively localization, site-specific preparation, and final analytical confirmation are combined into a coherent workflow. The key challenge is not only to identify the failure site, but to move efficiently from that location to reliable root-cause determination.
This contribution outlines an integrated workflow for physical failure analysis, spanning localization, precision sample preparation, and high-resolution physical analysis. The focus is on how these steps work together to improve the success rate, reduce the time to answer, and increase confidence in the final diagnosis. Rather than concentrating on a particular device architecture, the contribution highlights a workflow-oriented approach that supports advanced semiconductor development and manufacturing.
Tomas Vystavel is R&D Director at Thermo Fisher Scientific, where he leads architect teams developing platforms for advanced microscopy and semiconductor workflows. His background is rooted in electron microscopy and materials characterization, with extensive experience across SEM, TEM, and FIB technologies in both research and product development. He has contributed to the development of new microscopy methods and workflow solutions across multiple application areas. He currently focuses on platform and workflow development, bringing together instrumentation, software, and application expertise to support more integrated and effective solutions.