Technical Program Committee
Track A: Quality and Reliability Assessment Techniques and Methods for Devices and Systems
Design for reliability; Built-in reliability; Virtual qualification; Reliability simulation; Advanced models for reliability prediction; Reliability test structures; Limits to accelerated tests; Screening methods; Yield/reliability relationship; Obsolescence; Counterfeiting.
Chair: Soon…
Members: Soon…
Track B: Reliability for Nanoelectronics
Fundamental semiconductor failure mechanisms and process-related reliability issues; Passivation stability and interface degradation; Hot-carrier injection; Negative-bias temperature instability (NBTI); Time-dependent dielectric breakdown {TDDB); Reliability of high-k dielectrics, advanced gate stacks, and metal gates; Low-k dielectrics and Cu interconnects; Metal migration: electromigration, stress migration, and thermo-mechanical aspects; Nonvolatile and programmable memory cell reliability; Silicon-on-Insulator (SOI) device reliability challenges; Circuitlevel reliability and system integration aspects; Nanoelectronic devices and scaling-induced effects; Reliability of novel nanoelectronic materials for advanced solid-state devices; 2D materials: variability, reliability, and device integration challenges; Emerging technologies: FeFETs, FeRAM, and other beyond-CMOS concepts.
Chair: Michael WALTL, TU Wien, Austria
Members: Soon…
Track C: Progress in Failure Analysis: Defect Detection and Analysis
Electron-, ion-, and optical beam techniques; Scanning probe techniques; Static or dynamic techniques; Backside techniques; Acoustic microscopy; Electric or magnetic field-based techniques; Electrical-, thermal-, and thermomechanical characterization; Sample preparation; Construction analysis; Failure analysis: case studies.
Chair: Soon…
Members: Soon…
Track D: Reliability of Microwave Devices and Circuits
Reliability of GaN HEMTs, GaAs pHEMTs, lnP HBTs, and SiGe devices; High-frequency degradation mechanisms and RF stress effects; Trap dynamics, charge instabilities, and current collapse in microwave devices; Reliability under high-power, high-frequency, and pulsed operation; Thermal management and self-heating challenges in RF power devices; Packaging, interconnects, and integration in RF and mm-wave systems; Reliability in applications such as 5G/6G, radar, satellite, and defense systems.
Chair: Soon…
Members: Soon…
Track E: Packaging- and Assembly Reliability and Failure Analysis
Electrical modeling and simulations for advanced packaging; Mechanical modeling and thermomechanical stress simulations; Reliability of 3D integration and through-silicon vias (TSVs); Flip-chip and solder joint reliability; Advanced substrates and interposer technologies; Chip/package interaction and system-in-package reliability; Failure analysis methods for packaging and assembly-induced degradation.
Chair: Soon…
Members: Soon…
Track F1 : Power Devices Reliability: Smart-Power Devices and Silicon Power Devices
Reliability of Smart-Power ICs and integrated drivers; Silicon MOSFET and IGBT aging mechanisms; Gate oxide integrity and charge trapping; Hot-carrier and BTI degradation in high-voltage devices; Lifetime prediction and physics-based modeling; Package stress, interconnect reliability, and thermal cycling; Robustness under automotive and industrial mission profiles.
Chair: Soon…
Members: Soon…
Track F2: Power Devices Reliability: Wide-Bandgap Devices
Reliability of SiC MOSFETs and GaN HEMTs; Threshold voltage stability and interface states; Short-circuit and avalanche ruggedness in WBG devices; Defect-related degradation and trap dynamics; High-temperature and high-frequency stress testing; Packaging and integration challenges for WBG modules; Reliability in fast-charging, renewable, and aerospace applications.
Chair: Soon…
Members: Soon…
Track F3: Power Devices Reliability: Power Electronic Systems
System-level reliability and fault tolerance; Reliability-oriented design of converters and inverters; Mission-profile-based testing and lifetime modeling; Reliability of modules, passives, and interconnects; Condition monitoring and predictive maintenance; Thermal management and cooling technologies; Standards, qualification, and field return analysis.
Chair: Soon…
Members: Soon…
Track G: Photonics Reliability
Reliability and lifetime of solar cells (Si, thin-film, perovskite, tandem); Photovoltaic degradation mechanisms and encapsulation challenges; Reliability of optoelectronic devices: lasers, LEDs, and photodetectors; Displays: OLED, micro-LED, and electronic ink stability under operation; Organic and hybrid electronics: reliability of TFTs, OLEDs, and emerging flexible devices; Packaging, encapsulation, and environmental stability in photonic and optoelectronic systems; Reliability testing methods for accelerated stress, thermal cycling, and humidity exposure.
Chair: Soon…
Members: Soon…
Track H: MEMS and Sensor Reliability
Reliability of MEMS devices: mechanical fatigue, stiction, and packaging challenges; MOEMS reliability: optical MEMS for communication, projection, and sensing; NEMS and nano-objects: scaling effects and reliability testing; Sensor reliability in harsh environments (automotive, aerospace, industrial); Bio-electronics and implantable devices: biocompatibility and long-term stability; Bio-sensors and nano-bio technologies for diagnostics and health monitoring; Environmental influences: humidity, corrosion, and contamination effects; Accelerated stress testing and lifetime prediction for micro- and nanosystems; Integration of MEMS/NEMS with ICs and heterogeneous systems.
Chair: Soon…
Members: Soon…
Track I : Extreme Environments and Radiation
Reliability of devices and circuits under extreme thermal, mechanical, and environmental stress; Electrostatic discharge (ESD) and electrical overstress (EOS) robustness; Latch-up phenomena and protection strategies in ICs and power devices; Electromagnetic compatibility (EMC) and electromagnetic interference (EMI) in circuits and systems; Radiation effects on semiconductor devices, circuits, and power electronic systems; Hardening techniques for space, avionics and other applications; System-level resilience and qualification standards for harsh environments.
Chair: Soon…
Members: Soon…
Track J: Automotive and Industrial Electronic Reliability
Reliability challenges in electric and hybrid-electric vehicles (EVs, HEVs); Batteries, supercapacitors, and energy storage systems; Powertrain electronics and drivetrain reliability; Charging stations, fast-charging systems, and vehicle-to-grid (V2G) interfaces; Thermal management solutions for automotive and industrial electronics; Reliability of electronics in harsh automotive and industrial environments; Standards, qualification, and safety requirements for mobility and industry applications.
Chair: Soon…
Members: Soon…